F. Wu and X. Zhang, “An inspection and classification method for chip solder joints using color grads and Boolean rules,” Robotics and Computer-Integrated Manufacturing, vol. 30, no. 5, pp. 517–526, 2014.
S. K. Bhat, R. Deshpande, P. Beck, S. Hegde, Y. S. Upadhyaya, and C. K. Ghosh, “Study on effect of thermo-structural loading on the PCB during Selective Soldering process using finite element method,” 2016 International Conference on Electronics Packaging (ICEP), 2016.
W.-Y. Wu, M.-J. J. Wang, and C.-M. Liu, “Automated inspection of printed circuit boards through machine vision,” Computers in Industry, vol. 28, no. 2, pp. 103–111, 1996.
N. Cai, J. Lin, Q. Ye, H. Wang, S. Weng, and B. W.-K. Ling, “A New IC Solder Joint Inspection Method for an Automatic Optical Inspection System Based on an Improved Visual Background Extraction Algorithm,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 1, pp. 161–172, 2016.
C. Benedek, O. Krammer, M. Janoczki, and L. Jakab, “Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed Circuit Boards,” IEEE Transactions on Industrial Electronics, vol. 60, no. 6, pp. 2318–2331, 2013..
J. A. Garcia-Pulido, G. Pajares, S. Dormido, and J. M. de la Cruz, “Recognition of a landing platform for unmanned aerial vehicles by using computer vision-based techniques,” Expert Systems with Applications, vol. 76, pp. 152-165, 2017.
C. Szegedy, V. Vanhoucke, S. Ioffe, J. Shlens, and Z. Wojna, “Rethinking the Inception Architecture for Computer Vision,” 2016 IEEE Conference on Computer Vision and Pattern Recognition (CVPR), 2016.
J. Pont-Tuset, P. Arbelaez, J. T.barron, F. Marques, and J. Malik, “Multiscale Combinatorial Grouping for Image Segmentation and Object Proposal Generation,” IEEE Transactions on Pattern Analysis and Machine Intelligence, vol. 39, no. 1, pp. 128–140, Jan. 2017.
F. Milletari, N. Navab, and S.-A. Ahmadi, “V-Net: Fully Convolutional Neural Networks for Volumetric Medical Image Segmentation,” 2016 Fourth International Conference on 3D Vision (3DV), 2016.
P. Reitz, S. R. Zorn, S. H. Trimborn, and A. M. Trimborn, “A new, powerful technique to analyze single particle aerosol mass spectra using a combination of OPTICS and the fuzzy c-means algorithm,” Journal of Aerosol Science, vol. 98, pp. 1–14, 2016.
J. C. Dunn, “A Fuzzy Relative of the ISODATA Process and Its Use in Detecting Compact Well-Separated Clusters,” Journal of Cybernetics, vol. 3, no. 3, pp. 32–57, 1973.
J. Bezdek, “Corrections for “FCM: the fuzzy c-means clustering algorithm,”,” Computers & Geosciences, vol. 11, no. 5, p. 660, 1985.
C. Bai, D. Dhavale, and J. Sarkis, “Complex investment decisions using rough set and fuzzy c-means: An example of investment in green supply chains,” European Journal of Operational Research, vol. 248, no. 2, pp. 507–521, 2016.